Jul：The board of directors resolved to approve the cash acquisition of the wafer manufacturing business split from the Keelung Branch of Luxembourg-based Diodes International Co., Ltd., the transfer of its related assets and the assumption of its related liabilities.
Sep：The small signal production line has been set up for verification and trial production.
Published the third edition of the Years Sustainability Report.
Dec：The board of directors invested NT$180 million in cash to acquire 40% of the equity of SeCos (Co., Ltd.).

Sep：Finished /Set up the expansion of 110KK automated production lines.
Oct：Issued the 2nd edition of the Company Sustainability Report.
Nov：Awarded by the Environmental Protection Agency of the Executive Yuan for participating in the 4th National Enterprise Environmental Protection Award.

Mar：New product (ESD and MOSFET) were officially mass produced and shipping.
Apr：The BOD approved expanded the automated production line through a capital expenditure of about NTD300 million.
May：Acquired the case of subsidiary the remaining shares of Yea Shin Technology (stock) Company, and the shareholding ratio was increased to 100%.
Jul：Passed the VDA 6.3 auditing by Dahl Technology ( Nasdaq: DIOD), an international semiconductor manufacturer in the United States.
Nov：New product (SiC) were officially shipping.
Issued the 1st edition of the Company Sustainability Report.
Dec：Subsidiary Yea Shin Tech. wafer manufactures 4-inch turn to 5-inch wafers, which have been put into production one after another.

Mar：The fab of subsidiary (Yea-Shin Tech.) completed the development of 6-inch wafers based on GPP process, which is an innovative processes for diode GPP.
Acquired the case of subsidiary the remaining shares of Yea Shin Technology (stock) Company, and the shareholding ratio was increased to 99.5%.
Sep：The BOD meeting approved the Kick off plan of the fully automated (first) production line through the capital expenditure of NT$70 million.
Dec：The board of directors approved the acquisition of a full set of production equipment for automotive electronic components packaging from Liteon Semi. (Keelung Plant).

Jan：Luzhu factory completed the production line positioning, operation and passed the environmental impact assessment and factory establishment approval.

Jul：Eris has obtained IATF 16949 : 2016 the manufacture of diode field certification by BSI in July 4, 2018(according to British Standards Institution). Invested in wafer fab YEA SHIN Technology Co., Ltd.

Nov：The certificate of recognition TEEMA Taiwan Outstanding SME 2014.

Oct：Reward the Technology Innovation Award of " TAIRONICS 2013 Taipei International Electronics Industry Technology Exhibition".

Fed：GreTai Securities Market listing application approved by SFC (Securities and Futures Commission)
Jun：Eris Technology Corp. is scheduled for listing on GTSM on June 29, 2012.
Dec：Accumulated capital reaches NT$444.28 million.

Feb：Eris receives ISO / IEC 17025: 2005 certification from the Taiwan Accreditation Foundation (TAF).
Mar：Eris adopts Knowledge management platform within the production management system.
Jul：Eris receives TS16949 certification from the British Standards Institution (BSI).
Aug：Eris receives ISO 14001 : 2004 certification from the BSI.
Sep：Cash flow reaches NT$100 million and accumulated capital reaches NT$333.51 million (around USD 11 million).
Dec：Accumulated capital reaches NT$393.27 million (around USD 13 million).

Jan：Eris adopts Knowledge platform to manage raw arterials.
Mar：Eris applies for two patents in Germany targeting manufacture and construction development for Schottky diodes with superior performance.
May：Eris sets up automatic diode manufacture, packaging, and additional TMTT facilities in Taiwan.
Jul：Eris receives ISO 9001 : 2008 certification.
Accumulated capital reaches NT$206.70 million at the end of July 2010.
Aug：Eris is recognized among the 13th set of “Rising Star Award” recipients. Taiwan‘s Ministry of Economic Affairs awards the prize to exemplary small and medium enterprises displaying competitiveness, export activity, and well-organized management structure.
Dec：Cash flow reaches NT$24 million and accumulated capital reaches NT$230.70 million.

Jan：Eris establishes its research and development department.
Mar：Eris adopts knowledge management platform to enhance the corporate management of effectiveness and efficiency.
Jul：Cash flow reaches NT$22 million and accumulated capital reaches NT$147 million.
Aug：Initial public offering is authorized by Securities and Futures Bureau.
Sep：Listed in the Taiwan Emerging Market ( Stock Code: 3675TT ).
Oct：Eris establishes a TMTT line in Taiwan.
Dec：Cash flow reaches NT$17.88 million and accumulated capital reaches NT$164.88 million.

Aug：Investment Commission approved via third-party indirect investment in Jiecheng Electronic Co.,Ltd. in Shanghai,China.
Oct：Cash flow reaches NT$60 million and accumulated capital reaches NT$125 million.

Jul：Cash flow reaches NT$25 million and accumulated capital reaches NT$65 million.

Jul：Cash flow reaches NT$15 million and accumulated capital reaches NT$40 million.

Jun：Eris adopts ERP system to organize and integrate records between various departments.
Jul：Cash flow reaches NT$8 million and accumulated capital reaches NT$25 million.

Mar：Eris establishes in-house quality assurance to supervise manufacturing process.
Jun：Eris establishes its central laboratory.
Aug：Eris adopts Enterprise Information Portal (EIP).

Jun：Entered sub-con franchises of finished-products.
Oct：Eris receives ISO 9001 : 2000 certification.
Dec：Eris establishes a reliability test laboratory in Taiwan.

May：Establishes test line in Taiwan to check wafer quality.
Dec：Cash flow reaches NT$7million and accumulated capital reaches NT$17million.

May： Cash flow reaches NT$5 million and accumulated capital reaches NT$10 million.

Aug：Eris Technology was founded with paid-in capital of NT$5 million. The company adopted “Eris” as the own brand and began entering into the strategic alliance with the German-based company SeCoS GmbH. It mainly sold the electronic upstream products, such as wafers, chips and others to Taiwan and China territories, etc.