Manufacturing Process
Die bonding process is preprocedure of next soldering process.
The soldering boat loaded with material is introduced into soldering furnace by conveyor.
Put the jointed semi-product in a forming mold, and then apply mold press to inject epoxy resin into forming mold.
The terminal of leadframe need to be trimmed and formed as specified dimensions with trim/form machine.
After trimming/froming, the surface of terminal need to be electroplated by a Sn layer, which is available to solderability improvement and to prevent from oxidation.
Implement 100% CCD inspection based on the appearance and dimension of each product.
The finished good needs to do a series of examinations and sorting by single cycle on TMTT tester.