Power Pack

Power Pack

1. Die Bonding Process

Die bonding process is preprocedure of next soldering process.

2. Soldering Process

The soldering boat loaded with material is introduced into soldering furnace by conveyor.

3. Molding and Curing Process

Put the jointed semi-product in a forming mold, and then apply mold press to inject epoxy resin into forming mold.

4. Plating Process

After trimming/froming, the surface of terminal need to be electroplated by a Sn layer, which is available to solderability improvement and to prevent from oxidation.

5. Trimming / Forming

The terminal of leadframe need to be trimmed and formed as specified dimensions with trim/form machine.

6. TMTT Process

Test electrical characteristics of finished products successively each time by TMTT machines.