Basic Measuring Equipment

Basic Measuring Equipment


Strict quality control and various tests in reliability allow us to guarantee the highest quality in our products. All our products are held to our rigorous standards and tested using our vast array of test equipment, including electrical characteristic test machines, thermal shock testers, pressure controlled testers (PCT), high temperature reverse bias (HTRB) testers, x-ray fluoroscopy devices, DE-CAP analysis equipment, thermal resistance junction testers (RTHJ), and the like.


2D Image-Type Mapping

Precise mapping of the size of the workpiece.

RING BOX Tester

The device is to test the noise figure status of diodes during their operation.

TRR Reverse Recovery Time Tester

This is to test the reverse recovery time (TRR) namely response time to fit in with clients' applications.

TVS Diode Tester

This is to test the surge reverse power of TVS diodes to know its quality status of transient power suppression.

Precision Diode Electrical Characteristic Testers

This is to test and measure the forward voltage, reverse breakdown voltage and reverse current of diodes precisely.

Diode Electrical Curve Tester

A curve trace deals specifically with curve trace measurements made on the I/O pins for continuity or for other parametric issues, such as input leakage, output drive currents, output voltage levels, etc.

Reverse Surge Tester

This is to test the reverse surge of Schottky diodes.

Forward Surge Tester

This is to proceed the test of constant forward surge for diodes under constant temperature or room temperature.

Zener Diode Tester

This is to test and measure the constant voltage, reverse breakdown voltage and reverse current of Zener diodes accurately.

Auto-Regulated Temperature Electrical Tester

It can measure electrical data of diodes at high temperature. The actual behavior could be simulated by different setting of ambient temperature.

Wafer AOI

Patent full angle LED lighting can obtain the best defect images and can be applied to the inspection for different problems. It can detect chipping, bump / pad scratch, discoloration, missing, shift, abnormal feature size and foreign object, etc. This system can work with off-line recheck station to enhance the throughput.