Quality
Strict quality control and various tests in reliability allow us to guarantee the highest quality in our products. All our products are held to our rigorous standards and tested using our vast array of test equipment, including electrical characteristic test machines, thermal shock testers, pressure controlled testers (PCT), high temperature reverse bias (HTRB) testers, x-ray fluoroscopy devices, DE-CAP analysis equipment, thermal resistance junction testers (RTHJ), and the like.
Energy Dispersive Spectrometer is equipped with Scanning Electron Microscope, enabling the analysis of qualitative and quantitative elements.
SAT microscope can detect defect such like delamination or crack inside device by nondestructive method.
XRF can measure elements instantly and nondestructive in material. This analysis can support customers to be approved of halogen-free standards inIEC directive.
The electron beam of Scanning Electron Microscope which only generates secondary electrons from its surface by scanning.
Energy Dispersive Spectrometer is equipped with Scanning Electron Microscope, enabling the analysis of qualitative and quantitative elements.
This is to test the tensile status of solder lead and die bonding before packaging.
For the test objects, a non-contact temperature detection of test objects.
The laser beam is used to remove the compound. This method can accurately control the size of the opening, reduce the risk of over removal, and reduce the chance of affecting the electrical performance of device.